Saito Seiki is a company specialized in designing and manufacturing machining equipment including silicon processors, glass processors, and other precision equipment.

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Our top and tail cutting machine for silicon ingots is now available.

Our top and tail cutting machine for silicon ingots is now available.

This machine makes it possible to cut the top and tail of ingots.

 

[Advantages related to the cylindrical grinder]

Easy centering: Improved perpendicularity on both end faces stabilizes and improves machining accuracy.

No need for skilled workers: The need for skilled workers to perform cylindrical grinder processing adjustment is eliminated.

More compact: The overall length of the cylindrical grinder body is reduced.

 

[Advantages related to the cutting machine]

Reduced processing time: Specializing in block and sample cutting shortens processing time.

Reduced working time: Eliminating the need to reverse the ingot shortens working time.

Reduced equipment footprint: Cutting the top and tail of the ingot reduces the length required for the cutting machine.

 

Please contact us using the Inquiry Form for details of this machine.

Development Manager Aiko

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